V810i S2 XXL : Advanced 3D X-ray Inspection System (V810i S2 XXL)


World fastest and best test coverage AXI system for PCB SMT assembly line
advanced 3d x-ray inspection system (axi) v810i s2 xxl
System V810i S2 XXL
System controller Integrated controller with 8 Core Intel Xeon processors
Operating system Windows 10 (64 bits)
Test Development Environment
User interface Microsoft Windows based software solution with easy-to-use GUI and password-protected user levels
Off-line test development software Optional for off-line PC
CAD conversion tool Optional software available to translate CAD data to ViTrox’s format
Typical test development time 4 hours to 1.5 days to convert raw CAD file and develop application
Line Integration
Transport heights 865 mm - 1025 mm
Line communication standard SMEMA, HERMES
Barcode readers Compatible with most industry standard barcode readers
Performance Parameters *
Total panel test cycle time 51.68 cm²/sec (8 in²/sec) at 19µm
Typical image acquisition rate 500 - 1000 ppm
Minimum features detection capability
Joint pitch1 0.3 mm and above
Short width2 0.045 mm
Solder thickness 0.0127 mm
Allowable Panel Characteristics **
Maximum panel size 660 mm x 965 mm (26"x38") (W x L)
Minimum panel size 76 mm x 76 mm (3" x 3" )
Maximum panel inspectable area 654 mm x 965 mm (25.75"x38") (W x L)
Maximum panel thickness 12.7 mm (500 mils)
Minimum panel thickness 0.5 mm (20 mils)
Panel warp Downside < 3.3 mm; Upside < 3.3 mm
Maximum panel weight 15kg
Board top clearance 25 mm @ 19 µm resolution
15 mm @ 13 µm resolution
* Calculated from Board Top surface
Board bottom clearance 80 mm
Panel edge clearance 3 mm
System resolution 19 µm/13 µm
100% Press-fit testability Yes (With PSP2 feature)
Maximum acceptable panel temperatures 40 Deg C
Power and Environmental
Voltage requirement 200 – 240 VAC three phase; 380 – 415 VAC three phase wye (+/- 5) (50Hz or 60Hz)
Air requirement 552kPA (80psi) compressed air
System footprint (Width X Depth X Height) 2240 mm x 2460 mm x 1980 mm
Total system weight ~5500 kg
*Note:
1. Assuming pad width is 50% of pitch.
2. The reported values for minimum feature detection assume that the feature is in a single plane of focus and that there are no X-ray absorbers in the X-ray path or in the immediate area of the feature other than those found in a typical multi-layer printed circuit board.

#2x2 binning camera configuration. Hardware upgrade is required on old system.

**Note:
1. Panels are handled on width edges. Panels with edge cut outs may require the use of a carrier.
2. Maximum panel size dimensions and weight must include carrier if applicable
3. Smaller panels are possible with the use of panel carriers.
4. With panels of this thickness, imaging results can be affected by PCBA layout.
5. Measured from the bottom of the panel including a maximum warp.