V810i S2 Series Advanced 3D X-ray Inspection (AXI)
Designed for various size of PCB assemblies to increase production efficiency and cost savings for Electronic Manufacturing Services (EMS), Original Equipment Manufacturers (OEMs), Original Design Manufacturers (ODMs), and etc.

Key Benefits

High Speed Inspection
Powerful and robust test algorithm that cover overall market test component
Lightning programming for smart and easy programming
Various Platform to cater different board sizes
World top leading AXI solution
Worldwide support coverage

Breakthrough Technologies
Lightning Programming

What is OLP?

OLP means for Offline Programming. It is a software to allow user to develop program on his/her own PC without connecting to machine.

The drag and drop concept eases programming and the inline OLP concept minimizes system downtime and increases product throughput.

Largest Board Size Platform
  1. Minimum and Maximum Panel Size
    127mm x 127mm - 1320.8mm x 1320.8mm
  2. Minimum and Maximum Panel Thickness 1.5mm to 10mm
  3. Maximum Panel Weight 25Kg
  5. The smart V810i S2XLW AXI solution offers the world-class board inspection capabilities and software compatible with Industry 4.0 for quality-assured inspection results. With its latest capability, the largest and heaviest PCB board weighing up to 25kg and up to 1.3m x 1.3m (length x width) in size can be accommodated and inspected.
New Reconstruction Method for CT Technologies - Algebraic Reconstruction Technique (ART)
Provide alternative view (3D model) for defects buy off and increase user confidence to buy off defect. At the same time, it will generate defect failure analysis for further improvement.
  1. Alternative view (3D model) for defects buyoff
  2. Increase users confident to buyoff defects
  3. Defect failure analysis
Backdrill Inspection
Back drilling, is a technique used at high speed multi-layered boards to remove the unused portion, or stub, or copper barrel from a thru-hole in a printed circuit board in order to minimize signal integrity degradation and reduce via-to-via crosstalk.

A typical through hole VIA without backdrill results in reflections, capacitance, & inductance discontinuities which will degrade the signal integrity

Backdrill the unused stub with a controlled depth

After backdrill, the signal will not flow to unwanted stub and minimize signal integrity degradation