Advanced 3D Solder Paste Inspection (API)

Our latest innovation in Advanced 3D Solder Paste Inspection (API) is designed to specially cater to different sizes of PCB assembly to be examined at micron level with maximum throughput. This translates to increased production efficiency and cost savings for manufacturers.
V310i Series

V310i Optimus

V310i XL

V310i XXL

V310i SE