V310i XL : Advanced 3D Solder Paste Inspection (API)

The V310i XL API system is a new launch solder paste vision platform integrated with Z-Height feature to maximize large board size inspection.
Solder paste inspection system (api) V310i XL
System V310i XL
System Performances
Inspection Functions Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge.
Board Level Tracebility Camera-Read Barcodes; External Barcode Reader Configured
System Hardware 12MP 4MP
Operating System Windows 10 Pro (64 bit)
Optical Resolution & FOV Size Default: 60mmx45mm @ 15µm telecentric lens
Option: 53mmx39mm @ 13µm telecentric lens
Option: 32mmx24mm @ 8µm telecentric lens
Default: 40mmx40mm @ 20µm telecentric lens
Inspection Speed 12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec

12MP CameraLink @ 15µm Resolution: Up to 60cm²/sec"
4MP CameraLink @ 20µm Resolution: Up to 55 cm²/sec
3D Technologies Phase Shift Profilometry’s (PSP) Methodology
Lighting Module Concurrent Lighting Module
Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA
PCB Dimension XL SL XL FDL
Maximum PCB Size (L x W) 460mmx690mm (18.1''x27.2'') DL Equal: 460mmx325mm (18.1''x12.8'')
Single Lane: 460mmx600mm (18.1''x23.6'')
Minimum PCB Size (L x W) 50mmx50mm (2”x2”) 50mmx50mm (2”x2”)
Maximum PCB Inspectable Area (L x W) 460mmx683mm (18.1''x26.8'') DL Equal: 460mmx318mm (18.1''x12.5'')
Single Lane: 460mmx593mm (18.1''x23.3'')
Maximum PCB Thickness 7mm (0.27") 7mm (0.27")
Minimum PCB Thickness 0.5mm (0.02") 0.5mm (0.02")
Maximum PCB Weight 3kg 3kg
Top Clearance of PCB 50mm 50mm
Bottom clearance of PCB 100mm 100mm
PCB Edge Clearance 3.5mm 3.5mm
PCB Transport Height 875mm-965mm
PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C.
Installation Specification
Power Supplies 100-120 V, 16A/200-240V, 8A Single Phase
Air requirement 0.6 Mpa/85 psi
System footprint (Width X Depth X Height) 1060mmx1440mmx2116mm
Total system weight ~960kgs