V310i SE : Advanced 3D Solder Paste Inspection (API)


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Solder paste inspection system (api) V310i SE
System V310i SE
System Performances
Inspection Functions Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge.
Board Level Tracebility Camera-Read Barcodes; External Barcode Reader
System Hardware
Operating System Windows 10 Pro (64 bit)
Camera & FOV Size 12MP CoaXPress Camera
60x45 mm @ 15um resolution
Optical Resolution Default: 15um telecentric lens*
Option: 13um telecentric lens*
Option: 8um telecentric lens*
Inspection Speed 4MP @ 20um resolution: 22-37cm2/sec
12MP @ 15um resolution: 45-60cm2/sec
3D Technologies Phase Shift Profilometry’s (PSP) Methodology with 4-way projectors
Lighting Module Concurrent Lighting Module
X-Y Gantry System Gantry Robot System with Ball Screw, Servo Motor and Magnetic Linear Encoder
Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA
PCB Dimension SE FDL
Maximum PCB Size (L x W) 510mmx540mm (20”x21.2”) Single Lane: 510mmx450mm (20''x17.7'')
DL Equal: 510mmx250mm (20”x9.8”)
Minimum PCB Size (L x W) 50mm x 50mm (2”x2”) 50mm x 50mm (2”x2”)
Maximum PCB Inspectable Area (L x W) 510mmx533mm (20”x20.9”) Single Lane: 510mmx443mm (20''x17.4'')
DL Equal: 510mmx243mm (20”x9.5”)
Maximum PCB Thickness 4mm (0.16") 4mm (0.16")
Minimum PCB Thickness 0.5mm (0.02") 0.5mm (0.02")
Maximum PCB Weight 3kg 3kg
Top Clearance of PCB 50mm 50mm
Bottom clearance of PCB 100mm 100mm
Panel Edge Clearance 3.5mm 3.5mm
PCB Transport Height 875mm - 965mm
PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C.
Installation Specification
Power Supplies 100-120 V, 16A/200-240V, 8A Single Phase
Air requirement 0.6 Mpa/85 psi
System footprint (Width X Depth X Height) 1060mm x 1303mm x 2000mm
Total system weight ~830 kgs