V810i S2 XLL
SMT PCB Assembly | Advanced 3D X-Ray Inspection (AXI)| Overview | Award-winning V810i 3D AXI Solution is designed specifically for the PCB manufacturing process. Equipped with high-resolution X-ray imaging technology and AI capabilities, the V810i 3D AXI Solution excels in hidden defect detection through comprehensive test coverage with high accuracy and high-speed performance. |
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| Key Features |
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| System controller | Integrated controller with 8 Core Intel Xeon processors |
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| Operating system | Windows 10 (64-bit) |
| Test Development Environment | |
| User interface | Microsoft Windows based software solution with easy-to-use GUI and password-protected user levels |
| Off-line test development software | Optional for off-line PC |
| CAD conversion tool | Support 4 different types of CAD in V810i software and optional software available to translate other CAD data to ViTrox's format |
| Typical test development time | 4 hours to 1.5 days to convert raw CAD file and develop application |
| Line Integration | |
| Transport heights | 865mm - 1025mm |
| Line communication standard | SMEMA, HERMES |
| Barcode readers | Compatible with most industry standard barcode readers |
| Performance Parameters | |
| False Call rate | 500 - 1000ppm |
| Minimum features detection capability | |
| Joint pitch¹ | 0.3mm and above |
| Short width² | 0.045mm |
| Solder thickness | 0.0127mm |
| Allowable Panel Characteristics | |
| Maximum PCB Size (L x W) | 1200.0mm x 660.4mm (47.24" x 26") |
| Minimum PCB Size (L x W) | 76.2mm x 76.2mm (3" x 3") |
| Maximum PCB inspectable area | 1200.0mm x 654.4mm (47.24" x 25.7") |
| Maximum PCB thickness | 12.7mm (500mils) |
| Minimum PCB thickness | 0.508mm (20mils) |
| PCB warp | Downside < 3.3mm; Upside < 3.3mm |
| Maximum PCB weight | 15kg |
| Top Clearance of PCB | 50mm @ 19µm resolution 31mm @ 15µm resolution 13mm @ 11µm resolution 31mm @ 10µm resolution# 13mm @ 7.5µm resolution# (Calculated from Board Top surface) |
| Bottom Clearance of PCB | 80mm |
| PCB edge clearance | 3mm |
| 100% Press-fit testability | Yes (With PSP2 / PSP2.1 feature) |
| PCB Temperature | 40⁰C |
| Safety Standards | X-ray radiation leakage is below 0.5 µSv/hr |
| Installation Specification | |
| Power Supplies | 200 – 240 VAC three phase; 380 – 415 VAC three phase wye (+/- 5) (50Hz or 60Hz) |
| Air requirement | 552kPA (80psi) |
| System footprint (Width X Depth X Height) | 2695mm x 2460mm x 1980mm |
| Total system weight | ~6700kgs |
| Remark | *Note 1: 1. Assuming pad width is 50% of pitch. 2. The reported values for minimum feature detection assume that the feature is in a single plane of focus and that there are no X-ray absorbers in the X-ray path or in the immediate area of the feature other than those found in a typical multi-layer printed circuit board. # 2x2 Binning Mode (hardware upgrade is required) **Note 2: 1. Panels are supported and transported along their width edges. For panels with edge cutouts, a carrier may be required to ensure proper handling and stability during the process. 2. The maximum panel size dimensions and weight must include carrier if applicable. 3. Smaller panels can be accommodated for testing with the use of panel carriers. 4. The imaging results may be affected by the layout of the surface-mounted components, depending on the thickness of the panel. 5. Bottom of the panel is the reference for the measurements including the maximum warpage. |
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