V810i S2 XLL

SMT PCB Assembly | Advanced 3D X-Ray Inspection (AXI)

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Overview Award-winning V810i 3D AXI Solution is designed specifically for the PCB manufacturing process. Equipped with high-resolution X-ray imaging technology and AI capabilities, the V810i 3D AXI Solution excels in hidden defect detection through comprehensive test coverage with high accuracy and high-speed performance.
Key Features
  1. World Top Leading High Speed 3D AXI Solution
  2. AI integrated to automate process for enhanced accuracy and efficiency
  3. Powerful and Robust AI test algorithms with comprehensive test component coverage for complicated inspection requirement
  4. High-resolution X-ray imaging for complex components inspection (heavily shaded and non-uniformly shaded component)
  5. Real-time closed-loop and data cross referencing among ViTrox solutions (SPI to AXI)
  6. Preferred choice of Top EMS Companies
  7. Smart manufacturing ready
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Advanced 3D X-Ray Inspection (AXI) V810i S2 XLL

System controller Integrated controller with 8 Core Intel Xeon processors
Operating system Windows 10 (64-bit)
Test Development Environment
User interface Microsoft Windows based software solution with easy-to-use GUI and password-protected user levels
Off-line test development software Optional for off-line PC
CAD conversion tool Support 4 different types of CAD in V810i software and optional software available to translate other CAD data to ViTrox's format
Typical test development time 4 hours to 1.5 days to convert raw CAD file and develop application
Line Integration
Transport heights 865mm - 1025mm
Line communication standard SMEMA, HERMES
Barcode readers Compatible with most industry standard barcode readers
Performance Parameters
False Call rate 500 - 1000ppm
Minimum features detection capability
Joint pitch¹ 0.3mm and above
Short width² 0.045mm
Solder thickness 0.0127mm
Allowable Panel Characteristics
Maximum PCB Size (L x W) 1200.0mm x 660.4mm (47.24" x 26")
Minimum PCB Size (L x W) 76.2mm x 76.2mm (3" x 3")
Maximum PCB inspectable area 1200.0mm x 654.4mm (47.24" x 25.7")
Maximum PCB thickness 12.7mm (500mils)
Minimum PCB thickness 0.508mm (20mils)
PCB warp Downside < 3.3mm; Upside < 3.3mm
Maximum PCB weight 15kg
Top Clearance of PCB 50mm @ 19µm resolution
31mm @ 15µm resolution
13mm @ 11µm resolution
31mm @ 10µm resolution#
13mm @ 7.5µm resolution#
(Calculated from Board Top surface)
Bottom Clearance of PCB 80mm
PCB edge clearance 3mm
100% Press-fit testability Yes (With PSP2 / PSP2.1 feature)
PCB Temperature 40⁰C
Safety Standards X-ray radiation leakage is below 0.5 µSv/hr
Installation Specification
Power Supplies 200 – 240 VAC three phase; 380 – 415 VAC three phase wye (+/- 5) (50Hz or 60Hz)
Air requirement 552kPA (80psi)
System footprint (Width X Depth X Height) 2695mm x 2460mm x 1980mm
Total system weight ~6700kgs
Remark *Note 1:
1. Assuming pad width is 50% of pitch.
2. The reported values for minimum feature detection assume that the feature is in a single plane of focus and that there are no X-ray absorbers in the X-ray path or in the immediate area of the feature other than those found in a typical multi-layer printed circuit board.

# 2x2 Binning Mode (hardware upgrade is required)

**Note 2:
1. Panels are supported and transported along their width edges. For panels with edge cutouts, a carrier may be required to ensure proper handling and stability during the process.
2. The maximum panel size dimensions and weight must include carrier if applicable.
3. Smaller panels can be accommodated for testing with the use of panel carriers.
4. The imaging results may be affected by the layout of the surface-mounted components, depending on the thickness of the panel.
5. Bottom of the panel is the reference for the measurements including the maximum warpage.
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