Overview | Award-winning V510i 3D AOI Solution, equipped with essential inspection functionalities, designed specifically for the PCB manufacturing process. The cost-effective V510i 3D AOI Solution provides high-resolution technology and AI-powered capabilities and excels in defect detection through comprehensive inspection coverage, high accuracy and high-speed performance. |
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Key Features |
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System Performances | ||
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Inspection Functions | Missing, Offset, Skewed, Polarity, Billboard, Tombstone, Lifted/Bent Leads, Excess/Insufficient Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), Foreign Material Detection, Polarity Dimple Measurement | |
Board & Component Level Traceability | Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging | |
System Hardware | ||
Operating System | Windows 10 (64-bit) | |
Optical Resolution & FOV Size * | Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens |
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Inspection Speed | 12MP CoaXPress @ 15μm resolution: up to 64cm²/sec | |
3D Technologies | Phase Shift Profilometry (PSP) Methodology with 4-way projectors | |
Lighting Module | Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module | |
Conveyor Width Adjustment | Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA | |
PCB Dimension | Standard | FDL |
Maximum PCB Size (L x W) | Single Lane·: 510mm x 540mm (20" x 21.2") Option: 610mm x 540mm (24" x 21.2") |
DL Equal: 510mm x 250mm (20" x 9.8") Single Lane: 510mm x 450mm (20" x 17.7") |
Minimum PCB Size (L x W) | 50mm x 50mm (2" x 2") | |
Maximum PCB Inspectable Area (L x W) | Single Lane: 510mm x 533mm (20" x 20.9") Option: 610mm x 533mm (24" x 20.9") |
DL Equal: 510mm x 243mm (20" x 9.5") Single Lane: 510mm x 443mm (20" x 17.4") |
Maximum PCB Thickness | 4mm (0.16") Option: 7mm (0.28") |
4mm (0.16") |
Minimum PCB Thickness | 0.5mm (0.02") | |
Maximum PCB Weight | 3kg (Option: 7kg) | 3kg |
Top Clearance of PCB | 50mm | |
Bottom Clearance of PCB | 100mm (Option: 90mm) | 100mm |
PCB Edge Clearance | 3.5mm | |
PCB Transport Height | 890mm - 965mm | |
PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. | |
Installation Specification | ||
System Footprint (Width X Depth X Height) | 1060mm x 1303mm x 2000mm | |
Total System Weight | ~830kgs | |
Power Supplies | 100-120V, 16A/200-240V, 8A Single Phase | |
Air Requirement | N/A | |
Remark | * Based on system configuration. Note: 1. 2D configuration option is available. Specifications are subject to change. |
Revolutionary high speed 3D AOI system for advanced packaging and microelectronics that resolve challenging micro-defect detection with automation and flexibility.
Revolutionary AOI platform designed for very tall component inspection coverage for top side (up to 100mm tall component)
Award-winning 3D AOI Solution designed to cater dual-sided assembly inspection, particularly post-THT wave-soldering and selective soldering processes.
Revolutionary AOI platform with 2-in-1 inspection capabilities (for conformal coating and final inspection)
Extended size capabilities for large board sizes up to 460mm x 690mm (18.1" x 27.2")
Extended size capabilities for extra large board sizes up to 1200mm x 690mm (47.2" x 27.2")
Extended size capabilities for extra large board sizes up to 1320.8mm x 1320.8mm (52" x 52")
Extended size capabilities for extra large board sizes up to 1200mm x 690mm (47.2" x 27.2")