Overview | Revolutionary Advanced Optical Inspection (AOI) platform with integrated 6-axis industrial robotic arm, providing flexibility for multi-angle inspection. It is the pioneer AOI platform that provides flexible 2-in-1 inspection capabilities for conformal coating and final assembly inspection within a single platform. * 3D functionality coming soon. |
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Key Features |
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System Performances | |
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Inspection Functions | Coating Splash, Bubbles, Insufficient, Foreign Object, Coating Scratch, O Peel, Missing Coating, Excess Coating, Coating on Connector, Keep-out-area, Coating Thickness Measurement Polarity/ Orientation, Absense/Presence, Knock-off, Component Chip-off, Foreign Object, PCB Exposed Copper, Assembly Inspection, Label Print Inspection, Label Quality Inspection, Connector Inspection |
Board and Component Level Traceability | Camera-Read Barcodes; External Barcode Reader Configured |
System Hardware | |
Operating System | Windows 10 (64-bit) |
Computer System | Intel i7-13700K, 32GB RAM, 1TB NVME M.2, 1TB HDD |
Camera and FOV Size | 8MP Colour Camera, FOV 60mm x 60mm (default) |
Optical Resolution | ~21μm/pixel |
Inspection Speed | 2D: 8MP @ 21μm resolution: 80cm²/sec |
3D Technologies | Phase Shift Profilometry (PSP) methodology with 4-way projectors |
Lighting Module | Multi-Angle Lighting & RGBW+UV Lighting |
X-Y-Z Axis Repeatabilty | ±20μm |
Panel Dimension | |
Maximum PCB Size (L x W) | 510mm x 510mm (20" x 20") |
Minimum PCB Size (L x W) | 50mm x 50mm (2" x 2") |
Maximum PCB Inspectable Area (L x W) | 510mm x 503mm (20" x 19.8") |
Maximum PCB Thickness | 20mm (0.79") |
Minimum PCB Thickness | 0.5mm (0.01969") |
Maximum PCB Weight | 15kg |
Top Clearance of PCB | 120mm |
Bottom Clearance of PCB | 120mm |
PCB Edge Clearance | 3.5mm |
PCB Transport Height | 890mm - 965mm |
PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. |
Thickness Measurement | |
Minimum Thickness | 25μm |
Installation Specification | |
System Footprint (Width X Depth X Height) | 1200mm x 1900mm x 1800mm |
Total System Weight | ~700kg |
Power Supplies | 100-120V, 16A/200-240V, 8A Single Phase |
Air Requirement | 0.6 Mpa/85 psi |
Remark | * Based on system configuration. Note: 1. 3D configuration option is available. |
Revolutionary high speed 3D AOI system for advanced packaging and microelectronics that resolve challenging micro-defect detection with automation and flexibility.
Revolutionary AOI platform designed for very tall component inspection coverage for top side (up to 100mm tall component)
Award-winning 3D AOI Solution designed to cater dual-sided assembly inspection, particularly post-THT wave-soldering and selective soldering processes.
Extended size capabilities for large board sizes up to 460mm x 690mm (18.1" x 27.2")
Extended size capabilities for extra large board sizes up to 1200mm x 690mm (47.2" x 27.2")
Extended size capabilities for extra large board sizes up to 1320.8mm x 1320.8mm (52" x 52")
Best-in-class 3D AOI Solution designed to cater for the PCB manufacturing process.
Extended size capabilities for extra large board sizes up to 1200mm x 690mm (47.2" x 27.2")