Inspect Hidden with ViTrox 3D AXI
X-ray inspection technology, commonly referred to as Automated X-ray Inspection (AXI), uses X-ray radiation to examine the internal structure of objects or products. In modern Surface Mount Technology (SMT) production lines, AXI machines are mainly used for automated inspection of hidden solder joints that are not visible to an AOI system. This non-destructive inspection enables the identification of concealed defects or anomalies that are imperceptible to the naked eye. The increasing adoption of inline AXI systems ensures continuous validation of PCB functionality during production, thereby reducing errors in real-time with automated precision.
2D vs 3D AXI: Choosing the Right Inspection System
The AXI inspection machine is primarily divided into two types of system: 2D and 3D automated X-ray inspection system. While 2D AXI systems are cost-effective and ideal for basic assembly inspection, they often struggle to detect hidden defects within multilayered assemblies. In contrast, 3D automated X-ray inspection machines have emerged as a more advanced solution. The 3D automated X-ray inspection system created detailed, three-dimensional representations that allow for the detection of hidden defects such as voids, solder joint integrity issues, and misplacements of components within multilayered circuits.
3D X-Ray inline systems are becoming more popular, 2D AXI systems remain relevant, especially in situations where cost and simplicity are more important. Both 2D and 3D AXI inspection technologies will coexist, with manufacturers choosing the one that best fits their production needs and budget. 3D X-Ray inspection systems, in particular, will continue to drive innovation and expand the capabilities of SMT AXI inspection equipment across different industries, improving automated, accurate, and efficient inspections.
ViTrox’s Revolutionary 3D Inline AXI System
To address the growing demands of the electronics assembly and SMT industries, ViTrox has developed the world’s fastest 3D inline X-ray inspection machine. Our 3D X-ray inspection machine represents a significant leap in inspection technology, designed to examine double-sided panels with exceptional defect coverage, high-speed performance, and a minimal false call rate.
Our latest innovation in Smart 3D X-Ray Inspection (AXI) machine is capable of handling the largest and heaviest board size in the market. By adopting our Smart 3D X-ray inspection machine, manufacturers can inspect a maximum 25kg and up to 1.3m x 1.3m (length x width) board size, making it suitable for a wide range of production requirements.
Our Smart 3D automated X-ray inspection machines can detect a wide range of detects, including missing components, shorts, opens, non-wetting, billboards, tombstones, lifted leads, solder balls, voids, insufficient solder, reversed tantalum capacitors, and excess solder. Equipped with the latest Smart 3D X-ray technology and advanced inspection capabilities, this machine ensures the inline inspection of hidden joints on PCBs within the required cycle time. The powerful test algorithm provides automated, full boards, 100% test coverage for PCB assemblies, inspecting a wide range of components such as integrated power electronic component (eg, IGBT), head-in pillow, package-on -package (PoP), plated through-hole (PTH), and various connector joint issues, offering a standard unmatched by other AXI machines.
The AXI machine also offers fully automated process optimization through AI integration, enhancing inspection efficiency and accuracy, particularly for challenging pads. The Smart 3D x-ray technology and AI features enable effortless automated programming, reducing setup time. With AI Classification, the machine improves accuracy for inspections of pads with multiple grayscale or unique profiles. Furthermore, the machine includes the AI VVTS, an automated defect buy-off feature that distinguishes between true and false defects with up to 95% accuracy. The integration of 3D x-ray, automated features, and inline inspection ensures optimal efficiency and reliability throughout the production process.
Our AXI machine is equipped with cutting-edge Smart 3D X-ray imaging and reconstruction methods that generate high-definition, high-quality Smart 3D X-ray images for accurate defect detection. The machine includes H-reconstruction, a unique imaging and reconstruction method for heavily shaded components, ensuring clarity even in complex inspection tasks like High-Speed 5G Connector Inspection and shaded BGA packages. Additionally, the machine employs the in-house-developed Algebraic Reconstruction Technique (ART), utilizing sharp geometric 3D X-ray computed tomography (CT) to create high-quality 3D models of BGA joint types, enhancing the automated inspection process and ensuring precise detection. Our AXI machine is designed to streamline automated inspection and deliver high-speed, highly accurate results across a wide range of applications.
Keep Updated New Feature For Innovation
Our inline AXI systems also features Dual Lane (DL) capabilities, a pioneering feature that significantly enhances the automated inspection throughput by up to 45% to 50% compared to traditional single-lane AXI systems. This advanced system enables automated and inline inspection of two boards simultaneously, using a stage-moving feature that expedites the inspection process by loading and scanning two boards concurrently. The system eliminates the need for dual scan paths, ensuring a faster, more efficient automated inspection process without compromising the quality of 3D X-ray images. These 3D X-ray images provide precise and dependable inspection results, ensuring accuracy across all boards.
Continued developments in semiconductor process capabilities have reduced chip node size and 3D X-ray dosage requirements, particularly for NAND and flash memory chips. This presented a huge problem for the AXI inspection system, as building systems with minimum 3D X-ray exposure while maintaining image quality for reliable categorization became increasingly difficult. In 2023, we successfully developed a low-dose imaging solution by incorporating new 3D X-ray scintillation material into our patented Gen 3.3 camera and adding aluminum-zinc filtration. This machine allows us to meet severe radiation dosage criteria of 30mGy, balancing reduced 3D X-ray exposure with the need for high-quality images required for accurate and stable component categorization during automated inline inspections. The solution's efficacy has been proved at a few selected client sites, with radiation exposures of 15mGy or fewer,ensuring exceptional performance in inline inspection systems for modern semiconductor production.
To enhance the user experience of our customers, our AXI Solutions are featured with the new boasts high imaging resolution Up to 2µm, Configurable to 30µm, ensuring capture every critical feature. The high-speed imaging capabilities, allowing it to process a full field of view (FOV) in 1.85s. This commitment to both high imaging resolution and high-speed imaging, even during faster inspections, and it comes with Resolution Up to 2µm, Configurable to 30µm. Furthermore, its wide tomography angle of up to 50° enhances its ability to capture comprehensive data. This advanced imaging, featuring Resolution Up to 2µm, Configurable to 30µm, is powered by an AI-Powered solution autonomous programming, AI inspection, and auto buyoff, streamlining workflow. Plus, it's ready for smart manufacturing, with support for IPC-CFX-2591, IPC Hermes-9852, and SECS GEM standards.
With these latest advanced features, ViTrox remains committed to innovation by providing world-class automated 3D X-ray inspection machines that support industries to achieve excellence through superior automated inspection technologies.
Industrial Features for PCB Manufacturing’s Success
Global manufacturers like PARPRO Technologies and AsteelFlash trust ViTrox’s 3D X-ray inspection machines to meet the demands of increasingly complex products. For instance, In early 2020, PARPRO Technologies purchased their first ViTrox 3D inline Smart X-ray Inspection System (AXI), the V810Ai S2EX system. PARPRO Technologies stated that our 3D automated X-Ray Inspection (AXI) machine is a clear choice to be part of their SMT line. The 3D automated X-Ray Inspection machine provides them the much needed latest innovations in smart 3D automated X-ray inspection as product complexity continues to grow. With the addition of these two units, 3D automated X-Ray Inspection machines not only improves their in-house X-ray inspection capability and enhances production efficiency; but, also make sure their top priority of product quality and reliability is achieved. Another customer, who is one of the top EMS companies, AsteelFlash even shared that by applying our 3D automated X-Ray Inspection machine to be in the manufacturing line because of its high test coverage for structural defects occurring at the solder. AsteelFlash believes that our 3D AXI delivers the quality it needs.
Hence, it showed that we remain at the forefront of innovation, delivering automated 3D X-ray inspection systems that enable industries to achieve excellence through reliable, precise, and efficient inspection mchines.
Why Choose ViTrox 3D AXI?
- High Speed Inspection
- Powerful and robust test algorithm that cover overall market test component
- Lightning programming for smart and easy programming
- Various Platform to cater different board sizes
- World top leading AXI solution
- Worldwide support coverage
