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What is Machine Vision?

Machine vision enables the automated visual inspection of manufactured products for quality and process control. Image is analyzed to determine the part's location, any defects, and dimensions. The results are then communicated to other equipments, such as programmable logic controllers, robots or motion controllers to perform a specific function.

Range of machine vision inspection solutions

  • Middle-End Semiconductor Vision Solutions
    Design & manufacture vision inspection system & handler for back-end semiconductor industry.
  • Back-End Semiconductor Vision Solutions
    Design & manufacture vision inspection system & handler for back-end semiconductor industry.
  • PCBA SMT Vision Solution
    Design & manufacture inline Advanced Solder Paste Inspection, Optical Inspection and X-ray Inspection System for the PCBA SMT Industry.
  • Industry 4.0 Smart Solutions
    Highly customizable open platform which offers data-driven decisions in the manufacturing process.
  • Integrated Industrial Embedded Solutions
    Design & manufacture IO cards & motion based controllers for System Automations and Control Industry.
  • V-AgriTech Solutions
    Designs, develops, and promotes innovative hi-tech smart agriculture solutions that significantly minimize labor dependency, improve yields and reduce pesticide usage in farms.

Tray to Tray & Tape & Reel IC Inspection Handler

Machine vision inspection to support emerging industries such as 5G, IoT, Automotive, Industry 4.0, etc. The solution has many innovative inspection capabilities and handles packages size up to 120 mm x 120 mm. It is suitable for various IC packages types, including BGA, QFP, QFN, CSP, TSSOP, MSOP, SOP and inspect for WETQFN, SiP, Lid Gap, Die Crack, Inner Crack, Side Exposed Copper, etc.

The A.I. OCR is trained by using large sets of data, resulting in exceptional accuracy when it comes to recognizing texts. The performance of the A.I. OCR is leaps and bounds ahead of regular OCR.

Die Sorting, Inspection & Package Solution

  • Designed for Die Sorting, Full 6 Sided Inspection and Tape & Reel Packaging.
  • High Speed Waffle to Tape and Reel Inspection (Dual Taping)
  • Support Waffle Tray Output in One Machine
  • Support Flip and Non-flip Process
  • 16 Positions for Flexible Process Configuration

Wafer Inspection System

  • Designed for 2D surface defect inspections and metrology.
  • To support various wafer forms including raw wafer, hoop ring, and framed wafer range
  • Providing inspection result data analysis and maintaining consistent, repeatable and reproducibility inspection results.
  • Bottom surface inspection and Infrared (IR) inspection.
  • Inspect sawline and crack inspection through the wafer frame tape.
  • Backside/bottom inspection for raw wafer under current defect capability at approximately 200μm gross defect.
  • Frame wafer through tape inspection under current chipping captured at >15μm.
  • Defect detection algorithm - Smart Thresholding
  • Detect low contrast area & low sensitivity area

Post Seal Vision Handler

  • After the tape sealing process
  • Reel-to-Reel Inspection for tape width ranging from 8 mm to 32 mm.
  • 2.5D lead inspection
  • Slanted mark inspection
  • Color inspections
  • Tape seal inspection
  • Mark inspection
  • Package inspection
  • Lead inspection
  • Bottom carrier tape inspection
  • Intelligent Mark Recognition excels regardless of resolution, font, or marking quality, interpreting characters amidst surrounding noise, enhancing decoding rates, supporting multiple colours in the foreground, and handling diverse character patterns
  • Improved productivity with dual-track
  • Flexibility to support various package types with multiple vision inspection
  • Fast changeover for different carrier tape widths
  • Automated mechanism for track & dummy reel width adjustment & tape insertion into dummy reel

Solder Paste Inspection (SPI) (Advanced Packaging and Microelectronics)

  • SPI Early detection helps reduce solder errors
  • Control one of the crucial steps affecting finished PCB quality.
  • Rapidly identified solder paste defects and align process variation
  • Artificial Intelligence (A.I.) Smart Programming
  • Related Defects: Zero print gap between stencil and PCB, Check paste smear underneath stencil, Check sufficient stencil tension, Ensure print accuracy and consistency for both print strokes, Verify stencil is dry after cleaning and before next print, Standard cleaning mode is wet/vacuum/dry, Check board support, Adjust separation speed to achieve minimum dog ears
  • Missing, XY Offset, Height, Area, Volume, Bridge and Micro Bridge. Extended Capabilities: Leadframe Inspection, Solder Bump Inspection, SiP Inspection

Automated Optical Inspection (AOI)

  • AOI Cater for various sizes of printed circuit board (PCB) assemblies. (Advanced Packaging and Microelectronics)
  • True 3D inspection technology to compensate the limitations of 2D inspection.
  • Machine Vision and Deep Learning Transforming
  • 3D Height Measurement & Color Scaling
  • AI Auto Programming
    . Geometry of component, Width Length & Height using 3D Information
    . Contact terminal vs Pad
    . Implement relative algorithm based on Component Sub-package type & IPC Class
    . Checking with warning alert if out of recommended threshold
    . Transforming image with shifting, rotating, enlargement with deep learning
    . Matching method which it has difficulty to handle marking size change, resolution (image blur), and orientation (angle)
    . Recognize alpha-numeric characters
    . Marking for orientation and wrong park check
  • Inspection Functions: Missing, Offset, Skewed, Polarity, Billboard, Tombstone, Lifted/Bent Leads, Excess/Insufficient Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), Foreign Material Detection, Polarity Dimple Measurement
  • Mirror/Shiny/Reflective Component Surface (Lead Frame or Substrate)
  • Component Offset, Die Presence, Die Offset, Die Coplanarity, Die Chip-off/Crack, Die Orientation, and other Surface Defects on Die (Scratches, Contamination, etc).
  • Wire bond inspection: Missing Wire, Broken Wire, Sagging/Shifted Wire, Off Pad Bonding, Ball Bond Diameter, Shorted Wire, Wrong Bond
  • Gold Pad/Finger Surface Inspection
  • Foreign Material Detection
  • Coordinates Measurement

X-Ray Inspection System (AXI)

  • X-ray Inspection is referring to the ability of the system to slice through different z-height with clear separation of top and bottom component without any artifact.
  • Isolates a thin slice of the solder joint from other slices
  • Joint location in field of view does not significantly impact appearance
  • Segregated into different slices making automated detection of defective joints become easy
  • 3D Computed Tomography(3DCT)
  • Algebraic Reconstruction Technology (ART)
  • 2 x 2 Bining
  • Inspection Functions: Head In Pillow (HIP), OPEN, Voiding, 100% PTH and Pressfit Testability, Package on Package, Misalignment, Short, Pressfit, Single Pad ( QFN, Copper Coin, Intersil), RNet,SMT Connector, Gullwing, Capacitor & Resistor, Leadless

Robotic Vision Solutions (ARV)

  • ARV Design and manufacture Advanced Robotic Vision Inspection System for small form factor mechanical assembly industry
  • Inspection Functions: Provides fast and reliable conformal coating inspection. It has multi-angle views with both ruled based & self-learned algorithms to cater for various inspection needs
  • Inspection Coverage: Coating Splash, Bubbles, Insufficient, Foreign Object, Coating Sratch, Orange Peel, Missing Coating, Excess Coating, Coating on Connector, Keep-out-area, Coating Thickness Measurement

Microcrack Inspection

  • Noise Filtering
  • Crack Line Gap Filling
  • Edge Extraction for better detection accuracy

Auto Light Source Conversion

  • Consists of multiple groups of light sources
  • Auto-trigger convert-by-recipe level

Short-wave infrared (SWIR Solution)

SWIR solutions are designed with the Military-grade camera to provide high definition vision inspection results. It is capable of inspecting inner defects such as inner crack, component missing, delamination, chip-off & etc. within the package devices especially WLCSP which is unachievable by using standard solutions.

The semiconductor industry has grown to become one of the world’s largest industries which covers a wide variety of applications, ranging from processor and memory integrated circuits for electronics to solar cells.

3D Ball Grid Array Inspection System

The solder balls soldered under the package and arranged in a grid pattern. As the demand for BGA in small package size has significantly increased in the recent trend, the quality of BGA has become highly important for industry.

It is suitable for turret-based handler solutions to provide high accuracy and quality inspection results. It also supports multi-pitch Ball Grid Array Inspection with size ranging from 1 mm x 1 mm to 16 mm x 16 mm.

Datamatrix Code: A Unique ID for Your Device

  • The solution does more than assisting users to scan information and trace devices
  • To decode information into a system faster and it results in fewer errors as it relies less on entering the information manually
  • Trace information such as images, vision results, and reports by simply scanning the ID
  • Prevent the wrong device or mix unit to enter the reel and ship out

Intelligent Mark Recognition

Intelligent Mark Recognition (IMR)A.I. OCR technology is not affected by camera resolutions, font size, or the quality of the marking. By accurately interpreting characters amidst surrounding noise, A.I. OCR also improves detection capabilities with a better decoding rate.