Machine vision inspection to support emerging industries such as 5G, IoT, Automotive, Industry 4.0, etc. The solution has many innovative inspection capabilities and handles packages size up to 120 mm x 120 mm. It is suitable for various IC packages types, including BGA, QFP, QFN, CSP, TSSOP, MSOP, SOP and inspect for WETQFN, SiP, Lid Gap, Die Crack, Inner Crack, Side Exposed Copper, etc.
The A.I. OCR is trained by using large sets of data, resulting in exceptional accuracy when it comes to recognizing texts. The performance of the A.I. OCR is leaps and bounds ahead of regular OCR.